LEICA DCM3D-confocal/Interferometric

The Leica DCM 3D system with dual core technology has been designed for fast, non-invasive assessment of micro and nano structures of technical surfaces, in multiple configurations.
The DCM 3D combines confocal and interferometry technology for high speed and high-resolution measurements down to 0.1nm.
And, the micro display confocal technology, with no moving parts, measures a variety of materials and provides confocal and bright field images simultaneously.


  • Roughness calculation
  • Odontology and dentitry samples Analysis
  • Surface quality
  • 3D topography
  • Analysis of plastic, ceramic and metal samples
  • Roughness / friction measurements
  • Peak-valley analysis
  • Forensic Analysis
  • Microlens
  • Coatings
  • Corrosion
  • Microelectronics
  • Micromechanics
  • Solar cells
  • Tribology
  • Transparent layers


  • Confocal and Interferometry — dual core technology for high-speed measurements and high-resolution, from 0.1 nm to 10 mm.
  • Interferometry PSI and VSI — provides the highest precision measurement of surfaces, with sub-nanometer resolution.
  • Micro display confocal technology — confocal and bright-field imaging of the same area simultaneously.
  • Fast, non-destructive 3D measurements — no sample preparation necessary (unlike what is needed for Scanning Electron Microscopy).
  • Optical / non-contact 3D surface measurement
  • Optical resolution (x/y) up to 0.15 μm possible
  • Vertical resolution in confocal mode <3 nm
  • Vertical resolution possible in interference mode <0.1 nm
  • Maximum sample weight 10 kg
  • Maximum sample height approx. 150 mm